High speed data optocoupler ISOCOM ICPL2601 with logic gate output and 10Mbit per second communication speed
Product Overview
The 6N137, ICPL2601, and ICPL2611 are high-speed optocoupler devices designed for data communication and interfacing applications. Each unit comprises an infrared emitting diode optically coupled to a high-speed integrated photo detector logic gate with a strobable output. These devices offer a 10Mbit/s data rate, high AC isolation voltage of 5000VRMS, and guaranteed performance across a temperature range of -40C to 85C. Key applications include line receivers, LSTTL to TTL/CMOS interfacing, data multiplexing, pulse transformer replacement, switch mode power supplies, and ground loop elimination.
Product Attributes
- Brand: ISOCOM COMPONENTS
- Certifications: UL File E91231 (for ICPL2601), VDE File 40044276 (marked as 6N137V)
- Compliance: Pb Free and RoHS Compliant
Technical Specifications
| Model | Description | Key Features | Applications |
|---|---|---|---|
| 6N137 | Optocoupler with logic gate output | High Speed (10Mbit/s), 5000VRMS Isolation, -40C to 85C operation | Line Receivers, Data Communication, LSTTL to TTL/CMOS, Data Multiplexing, Pulse Transformer Replacement, Switch Mode Power Supplies, Ground Loop Elimination, Computer Peripheral Interface |
| ICPL2601 | Optocoupler with logic gate output | High Speed (10Mbit/s), 5000VRMS Isolation, -40C to 85C operation, UL Approved | Line Receivers, Data Communication, LSTTL to TTL/CMOS, Data Multiplexing, Pulse Transformer Replacement, Switch Mode Power Supplies, Ground Loop Elimination, Computer Peripheral Interface |
| ICPL2611 | Optocoupler with logic gate output | High Speed (10Mbit/s), Minimum Common Mode Transient Immunity 10kV/s, 5000VRMS Isolation, -40C to 85C operation | Line Receivers, Data Communication, LSTTL to TTL/CMOS, Data Multiplexing, Pulse Transformer Replacement, Switch Mode Power Supplies, Ground Loop Elimination, Computer Peripheral Interface |
Electrical Characteristics
| Parameter | Symbol | Test Condition | Min | Typ. | Max | Unit |
|---|---|---|---|---|---|---|
| Absolute Maximum Ratings (TA = 25C) | ||||||
| Input Forward Current | 50 | mA | ||||
| Reverse Voltage | 5 | V | ||||
| Power dissipation | 100 | mW | ||||
| Output Current | 50 | mA | ||||
| Output Voltage | 7.0 | V | ||||
| Power Dissipation | 85 | mW | ||||
| Supply Voltage | 7.0 | V | ||||
| Enable Input Voltage (maximum 500mV above VCC) | 5.5 | V | ||||
| Total Package Isolation Voltage | 5000 | VRMS | ||||
| Operating Temperature | TA | -40 | 85 | C | ||
| Storage Temperature | -55 | 125 | C | |||
| Lead Soldering Temperature (10s) | 260 | C | ||||
| Recommended Operating Conditions | ||||||
| Operating Temperature | TA | -40 | 85 | C | ||
| Supply Voltage | VCC | 4.5 | 5.5 | V | ||
| Input Current, High Level | IF(ON) | 5 | 10 | mA | ||
| Input Current, Low Level | IF(OFF) | 0 | 250 | A | ||
| Enable Voltage, High Level | VEH | 2.0 | VCC | V | ||
| Enable Voltage, Low Level | VEL | 0 | 0.8 | V | ||
| Electrical Characteristics (TA = -40 to 85C unless otherwise specified) | ||||||
| High Level Supply Current | ICCH | IF = 0mA, VCC = 5.5V, VE = 0.5V | 7 | 10 | mA | |
| Low Level Supply Current | ICCL | IF = 10mA, VCC = 5.5V | 9 | 13 | mA | |
| High Level Enable Current | IEH | VCC = 5.5V, VE = 2.0V | -0.6 | -1.6 | mA | |
| Low Level Enable Current | IEL | VCC = 5.5V, VE = 0.5V | -0.8 | -1.6 | mA | |
| High Level Enable Voltage | VEH | IF = 10mA, VCC = 5.5V | 2.0 | V | ||
| Low Level Enable Voltage | VEL | IF = 10mA, VCC = 5.5V | 0.8 | V | ||
| High Level Output Current | IOH | IF = 250A, VCC = 5.5V, VE = 2.0V, VO = 5.5V | 2.1 | 100 | A | |
| Low Level Output Voltage | VOL | IF = 5mA, VCC = 5.5V, VE = 2.0V, IOL = 13mA | 0.35 | 0.6 | V | |
| Forward Voltage | VF | IF = 10mA | 1.4 | 1.8 | V | |
| Forward Voltage Temperature Coefficient | VF/T | IF = 10mA | -1.8 | mV/C | ||
| Reverse Voltage | VR | IR = 10A | 5.0 | V | ||
| Input Capacitance | CIN | VF = 0V, f = 1MHz | 60 | pF | ||
| Coupled Characteristics (TA = -40 to 85C unless otherwise specified) | ||||||
| Input Threshold Current | IFT | VCC = 5.5V, VO = 0.6V, VE = 2.0V, IOL = 13mA | 2.5 | 5 | mA | |
| Switching Characteristics (IF = 7.5mA, VCC = 5V unless otherwise specified) | ||||||
| Propagation Delay Time to High Output Level | tPLH | RL = 350, CL = 15pF, TA = 25C | 35 | 75 | ns | |
| Propagation Delay Time to Low Output Level | tPHL | RL = 350, CL = 15pF | 40 | 75 | ns | |
| Pulse Width Distortion | |tPHL - tPLH| | RL = 350, CL = 15pF | 5 | 35 | ns | |
| Output Rise Time (10% to 90%) | tr | 40 | ns | |||
| Output Fall Time (90% to 10%) | tf | 10 | ns | |||
| Enable Propagation Delay Time to High Output Level | tELH | VEH = 3.5V, RL = 350, CL = 15pF | 15 | ns | ||
| Enable Propagation Delay Time to Low Output Level | tEHL | 15 | ns | |||
| Common Mode Transient Immunity at Logic High (CMH) | 6N137, IF = 0mA, VOH = 2.0V, RL = 350, VCM = 10Vp-p, TA = 25C | 5000 | V/s | |||
| Common Mode Transient Immunity at Logic High (CMH) | ICPL2601, IF = 0mA, VOH = 2.0V, RL = 350, VCM = 50Vp-p, TA = 25C | 5000 | V/s | |||
| Common Mode Transient Immunity at Logic High (CMH) | ICPL2611, IF = 0mA, VOH = 2.0V, RL = 350, VCM = 400Vp-p, TA = 25C | 10000 | V/s | |||
| Common Mode Transient Immunity at Logic High (CMH) - ICPL2611 High CMR | IF = 0mA, VOH = 2.0V, RL = 350, VCM = 400Vp-p, TA = 25C | 20000 | V/s | |||
| Common Mode Transient Immunity at Logic Low (CML) | 6N137, IF = 7.5mA, VOL = 0.8V, RL = 350, VCM = 10Vp-p, TA = 25C | 5000 | V/s | |||
| Common Mode Transient Immunity at Logic Low (CML) | ICPL2601, IF = 7.5mA, VOL = 0.8V, RL = 350, VCM = 50Vp-p, TA = 25C | 5000 | V/s | |||
| Common Mode Transient Immunity at Logic Low (CML) | ICPL2611, IF = 7.5mA, VOL = 0.8V, RL = 350, VCM = 400Vp-p, TA = 25C | 10000 | V/s | |||
| Common Mode Transient Immunity at Logic Low (CML) - ICPL2611 High CMR | IF = 7.5mA, VOL = 0.8V, RL = 350, VCM = 400Vp-p, TA = 25C | 20000 | V/s | |||
| Insulation Voltage | VISO | RH = 40% - 60%, TA = 25C, t = 1 min | 5000 | VRMS | ||
Order Information
| Part Number Suffix | Description | Packing Quantity | Approvals |
|---|---|---|---|
| (None) | Standard DIP8 | 45 pcs per tube | |
| G | 10mm Lead Spacing | 45 pcs per tube | |
| SM | Surface Mount | 45 pcs per tube | |
| SMT&R | Surface Mount Tape & Reel | 1000 pcs per reel | |
| ICPL2601 | UL Approval | ||
| 6N137 | UL and VDE Approvals | ||
| ICPL2611 | Safety Approval Pending |
Package Dimensions
Refer to provided diagrams for DIP and SMD package dimensions, as well as recommended pad layout for SMD.
Tape and Reel Packaging
Refer to provided diagrams for tape and reel packaging dimensions.
IR Reflow Soldering Temperature Profile
One-time reflow soldering is recommended. Do not immerse device body in solder paste. Refer to the provided temperature profile chart for detailed conditions including preheat, soldering zone, and ramp rates.
2410121652_ISOCOM-ICPL2601_C255749.pdf
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