High speed data optocoupler ISOCOM ICPL2601 with logic gate output and 10Mbit per second communication speed

Key Attributes
Model Number: ICPL2601
Product Custom Attributes
Output Current:
50mA
Low Level Delay Time:
75ns
High Level Delay Time:
75ns
Input Threshold Current:
5mA
Reverse Voltage:
5V
Voltage - Forward(Vf):
1.4V
Voltage - Supply:
4.5V~5.5V
Forward Current(If):
10mA
Operating Temperature:
-40℃~+85℃
Isolation Voltage(Vrms):
5kV
Number Of Channels:
1
Input Type:
DC
Mfr. Part #:
ICPL2601
Package:
DIP-8
Product Description

Product Overview

The 6N137, ICPL2601, and ICPL2611 are high-speed optocoupler devices designed for data communication and interfacing applications. Each unit comprises an infrared emitting diode optically coupled to a high-speed integrated photo detector logic gate with a strobable output. These devices offer a 10Mbit/s data rate, high AC isolation voltage of 5000VRMS, and guaranteed performance across a temperature range of -40C to 85C. Key applications include line receivers, LSTTL to TTL/CMOS interfacing, data multiplexing, pulse transformer replacement, switch mode power supplies, and ground loop elimination.

Product Attributes

  • Brand: ISOCOM COMPONENTS
  • Certifications: UL File E91231 (for ICPL2601), VDE File 40044276 (marked as 6N137V)
  • Compliance: Pb Free and RoHS Compliant

Technical Specifications

Model Description Key Features Applications
6N137 Optocoupler with logic gate output High Speed (10Mbit/s), 5000VRMS Isolation, -40C to 85C operation Line Receivers, Data Communication, LSTTL to TTL/CMOS, Data Multiplexing, Pulse Transformer Replacement, Switch Mode Power Supplies, Ground Loop Elimination, Computer Peripheral Interface
ICPL2601 Optocoupler with logic gate output High Speed (10Mbit/s), 5000VRMS Isolation, -40C to 85C operation, UL Approved Line Receivers, Data Communication, LSTTL to TTL/CMOS, Data Multiplexing, Pulse Transformer Replacement, Switch Mode Power Supplies, Ground Loop Elimination, Computer Peripheral Interface
ICPL2611 Optocoupler with logic gate output High Speed (10Mbit/s), Minimum Common Mode Transient Immunity 10kV/s, 5000VRMS Isolation, -40C to 85C operation Line Receivers, Data Communication, LSTTL to TTL/CMOS, Data Multiplexing, Pulse Transformer Replacement, Switch Mode Power Supplies, Ground Loop Elimination, Computer Peripheral Interface

Electrical Characteristics

Parameter Symbol Test Condition Min Typ. Max Unit
Absolute Maximum Ratings (TA = 25C)
Input Forward Current 50 mA
Reverse Voltage 5 V
Power dissipation 100 mW
Output Current 50 mA
Output Voltage 7.0 V
Power Dissipation 85 mW
Supply Voltage 7.0 V
Enable Input Voltage (maximum 500mV above VCC) 5.5 V
Total Package Isolation Voltage 5000 VRMS
Operating Temperature TA -40 85 C
Storage Temperature -55 125 C
Lead Soldering Temperature (10s) 260 C
Recommended Operating Conditions
Operating Temperature TA -40 85 C
Supply Voltage VCC 4.5 5.5 V
Input Current, High Level IF(ON) 5 10 mA
Input Current, Low Level IF(OFF) 0 250 A
Enable Voltage, High Level VEH 2.0 VCC V
Enable Voltage, Low Level VEL 0 0.8 V
Electrical Characteristics (TA = -40 to 85C unless otherwise specified)
High Level Supply Current ICCH IF = 0mA, VCC = 5.5V, VE = 0.5V 7 10 mA
Low Level Supply Current ICCL IF = 10mA, VCC = 5.5V 9 13 mA
High Level Enable Current IEH VCC = 5.5V, VE = 2.0V -0.6 -1.6 mA
Low Level Enable Current IEL VCC = 5.5V, VE = 0.5V -0.8 -1.6 mA
High Level Enable Voltage VEH IF = 10mA, VCC = 5.5V 2.0 V
Low Level Enable Voltage VEL IF = 10mA, VCC = 5.5V 0.8 V
High Level Output Current IOH IF = 250A, VCC = 5.5V, VE = 2.0V, VO = 5.5V 2.1 100 A
Low Level Output Voltage VOL IF = 5mA, VCC = 5.5V, VE = 2.0V, IOL = 13mA 0.35 0.6 V
Forward Voltage VF IF = 10mA 1.4 1.8 V
Forward Voltage Temperature Coefficient VF/T IF = 10mA -1.8 mV/C
Reverse Voltage VR IR = 10A 5.0 V
Input Capacitance CIN VF = 0V, f = 1MHz 60 pF
Coupled Characteristics (TA = -40 to 85C unless otherwise specified)
Input Threshold Current IFT VCC = 5.5V, VO = 0.6V, VE = 2.0V, IOL = 13mA 2.5 5 mA
Switching Characteristics (IF = 7.5mA, VCC = 5V unless otherwise specified)
Propagation Delay Time to High Output Level tPLH RL = 350, CL = 15pF, TA = 25C 35 75 ns
Propagation Delay Time to Low Output Level tPHL RL = 350, CL = 15pF 40 75 ns
Pulse Width Distortion |tPHL - tPLH| RL = 350, CL = 15pF 5 35 ns
Output Rise Time (10% to 90%) tr 40 ns
Output Fall Time (90% to 10%) tf 10 ns
Enable Propagation Delay Time to High Output Level tELH VEH = 3.5V, RL = 350, CL = 15pF 15 ns
Enable Propagation Delay Time to Low Output Level tEHL 15 ns
Common Mode Transient Immunity at Logic High (CMH) 6N137, IF = 0mA, VOH = 2.0V, RL = 350, VCM = 10Vp-p, TA = 25C 5000 V/s
Common Mode Transient Immunity at Logic High (CMH) ICPL2601, IF = 0mA, VOH = 2.0V, RL = 350, VCM = 50Vp-p, TA = 25C 5000 V/s
Common Mode Transient Immunity at Logic High (CMH) ICPL2611, IF = 0mA, VOH = 2.0V, RL = 350, VCM = 400Vp-p, TA = 25C 10000 V/s
Common Mode Transient Immunity at Logic High (CMH) - ICPL2611 High CMR IF = 0mA, VOH = 2.0V, RL = 350, VCM = 400Vp-p, TA = 25C 20000 V/s
Common Mode Transient Immunity at Logic Low (CML) 6N137, IF = 7.5mA, VOL = 0.8V, RL = 350, VCM = 10Vp-p, TA = 25C 5000 V/s
Common Mode Transient Immunity at Logic Low (CML) ICPL2601, IF = 7.5mA, VOL = 0.8V, RL = 350, VCM = 50Vp-p, TA = 25C 5000 V/s
Common Mode Transient Immunity at Logic Low (CML) ICPL2611, IF = 7.5mA, VOL = 0.8V, RL = 350, VCM = 400Vp-p, TA = 25C 10000 V/s
Common Mode Transient Immunity at Logic Low (CML) - ICPL2611 High CMR IF = 7.5mA, VOL = 0.8V, RL = 350, VCM = 400Vp-p, TA = 25C 20000 V/s
Insulation Voltage VISO RH = 40% - 60%, TA = 25C, t = 1 min 5000 VRMS

Order Information

Part Number Suffix Description Packing Quantity Approvals
(None) Standard DIP8 45 pcs per tube
G 10mm Lead Spacing 45 pcs per tube
SM Surface Mount 45 pcs per tube
SMT&R Surface Mount Tape & Reel 1000 pcs per reel
ICPL2601 UL Approval
6N137 UL and VDE Approvals
ICPL2611 Safety Approval Pending

Package Dimensions

Refer to provided diagrams for DIP and SMD package dimensions, as well as recommended pad layout for SMD.

Tape and Reel Packaging

Refer to provided diagrams for tape and reel packaging dimensions.

IR Reflow Soldering Temperature Profile

One-time reflow soldering is recommended. Do not immerse device body in solder paste. Refer to the provided temperature profile chart for detailed conditions including preheat, soldering zone, and ramp rates.


2410121652_ISOCOM-ICPL2601_C255749.pdf

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