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quality Photoelectric Coupler HENGTUO HT-817S1-ATP1 Featuring High Current Transfer Ratio and RoHS Compliance factory
quality Photoelectric Coupler HENGTUO HT-817S1-ATP1 Featuring High Current Transfer Ratio and RoHS Compliance factory

Photoelectric Coupler HENGTUO HT-817S1-ATP1 Featuring High Current Transfer Ratio and RoHS Compliance

Key Attributes
Model Number: HT-817S1-ATP1
Product Custom Attributes
Fall Time:
3us
Output Current:
50mA
Rise Time:
4us
Vce Saturation(VCE(sat)):
100mV@20mA,20mA
Operating Temperature:
-55℃~+110℃
Load Voltage:
80V
Reverse Voltage:
6V
Current Transfer Ratio:
80%;160%
Forward Current(If):
50mA
Pd - Power Dissipation:
200mW
Number Of Channels:
-
Load Type:
Phototransistor
Input Type:
DC
Isolation Voltage(Vrms):
5kV
Mfr. Part #:
HT-817S1-ATP1
Package:
SMD-4P
Product Description

Product Overview

The HT-817X is a photoelectric coupler designed for general electronic applications. It features a light-emitting diode and a phototransistor housed in a 4-pin DIP package, with options for wide-lead spacing and SMD. Key advantages include a high current transfer ratio (CTR), superior input-output isolation voltage (5,000Vrms), and a wide operating temperature range of -55 to 110. This product is certified by UL, VDE, and CQC, and is RoHS and MSL1 compliant. It is suitable for applications such as programmable controllers, switching power supplies, intelligent meters, and various home appliances including air conditioners, fans, and water heaters.

Product Attributes

  • Brand: Hengtuo Technology Co., LTD. (HT)
  • Product Series: 817X
  • Certifications: UL 1577, VDE DIN EN60747-5-5 (VDE 0884-5), CQC11-471543-2022
  • Compliance: RoHS, MSL1
  • Lead Frame Material Options: Iron (F), Copper (NONE)
  • VDE Order Option: V
  • Halogen Free Option: G

Technical Specifications

Parameter Symbol Values Unit Condition
Input Forward Current IF 50 mA
Reverse Voltage VR 6 V
Power Dissipation P 70 mW
Peak Forward Current (100s pulse, 100Hz) IFP 1 A
Thermal Resistance Junction-Ambient RthJ-A 325 C/W
Thermal Resistance Junction-Case RthJ-C 200 C/W
Output Collector - Emitter Voltage VCEO 80 V
Emitter - Collector Voltage VECO 6 V
Collector Current IC 50 mA
Collector Power Dissipation PC 150 mW
Operating Temperature Range Top -55 ~ 110 C
Storage Temperature Range Tstg -55 ~ 125 C
Total Power Consumption P(W) 200 mW
Isolation Voltage VISO 5000 Vrms AC for 1 minute, R.H.= 40 ~ 60% R.H.
Soldering Temperature TSOL 260 C For 10 seconds
Input Forward Voltage VF - 1.2 1.4 V IF=20mA
Reverse Current IR - - 10 A VR=4V
Terminal Capacitance Ct - 30 250 pF V=0, f=1KHz
Output Collector Dark Current ICEO - - 100 nA VCE=20V, IF=0
Collector-Emitter Breakdown Voltage BVCEO 80 V IC=0.1mA, IF=0
Emitter-Collector Breakdown Voltage BVECO 6 V IE=10A, IF=0
Collector-Emitter Saturation Voltage VCE(sat) 0.1 0.2 V IF=20mA, IC=1mA
Isolation Resistance Riso 51010 11011 - DC500V, 40 ~ 60% R.H.
Floating Capacitance Cf 0.6 1 pF V=0, f=1MHz
Cut-off Frequency fc 80 kHz VCE=5V, IC=2mA RL=100,-3d B
Response Time (Rise) tr 4 18 s VCE=2V, IC=2mA RL=100,
Response Time (Fall) tf 3 18 s VCE=2V, IC=2mA RL=100,
Current Transfer Ratio (CTR=IC/IF x 100%) CTR MIN. 50% % IF = 5mA, VCE = 5V
CTR Rank (NONE) CTR 50 600 % IF=5mA, VCE=5V, Ta=25C
CTR Rank (A) 80 160 % IF=5mA, VCE=5V, Ta=25C
CTR Rank (B) 130 260 % IF=5mA, VCE=5V, Ta=25C
CTR Rank (C) 200 400 % IF=5mA, VCE=5V, Ta=25C
CTR Rank (D) 300 600 % IF=5mA, VCE=5V, Ta=25C

Product Nomenclature: HT-817X-X X- X X X- XX

Designation Breakdown:

  • HT: Hengtuo Technology Co.,LTD.
  • 817: Product Series
  • Lead form option: S1 (DIP4-S1), M (DIP4-M), NONE (DIP4 Normal)
  • CTR Rank: A, B, C, D (Specific Rank), NONE (No Rank)
  • Tape and Reel option: TP, TP1 (Tape and Reel Type), NONE (DIP Type)
  • Lead frame Material: F (Iron), NONE (Copper)
  • VDE order option: V (fixed code)
  • Halogen free option: G (fixed code)
  • Customer code

Marking Information: HT = Hengtuo, 817 = Device, C = CTR Rank, YY = Year Code, WW = Week Code, V = VDE

Outline Dimensions (DIP Normal Type): Unit: mm, Tolerance: 0.1mm

Outline Dimensions (DIP M Type): Unit: mm, Tolerance: 0.1mm

Outline Dimensions (DIP S1 Type): Unit: mm, Tolerance: 0.1mm

Recommended Solder Pad Design (S1 type): Unit: mm, Tolerance: 0.1mm

Soldering Temperature Profile (IR Reflow): Preheat: 150C Min, 200C Max, 9030 sec (ts); Soldering Zone: 217C (TL), 60-150 sec (tL); Peak Temp: 260C (TP), 30 sec (TP-5 to TP); Ramp-up: 3C/sec max; Ramp-down: 3~6C/sec.

Soldering Temperature Profile (Wave Soldering): Temperature: 260+0/-5C, Time: 10 sec; Preheat Temp: 25 to 140C, Preheat Time: 30 to 80 sec.

Hand Soldering: Temperature: 380+0/-5C, Time: 3 sec max per lead.

Packing (Tape and Reel Option TP): QTY/PCS: 2K/reel, 4K(2 reels), 40K

Packing (Tape and Reel Option TP1): QTY/PCS: 2K/reel, 4K(2 reels), 40K

Packing (Tape and Tube - DIP S1 Type): Tube Inner carton Outer carton QTY/PCS: 100, 5K(50 Tubes), 50K

Packing (Tape and Tube - Normal & M Type): Tube Inner carton Outer carton QTY/PCS: 100, 5K(50 Tubes), 50K


2411271635_HENGTUO-HT-817S1-ATP1_C34376179.pdf

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