Photoelectric coupler HENGTUO PC-1019-TP1 suitable for home appliances like fans water heaters and air conditioners
Key Attributes
Model Number:
PC-1019-TP1
Product Custom Attributes
Output Current:
50mA
Fall Time:
18us
Rise Time:
18us
Vce Saturation(VCE(sat)):
300mV@10mA,1mA
Operating Temperature:
-55℃~+110℃
Load Voltage:
80V
Reverse Voltage:
6V
Current Transfer Ratio:
200%;400%
Forward Current(If):
50mA
Pd - Power Dissipation:
200mW
Number Of Channels:
-
Load Type:
Phototransistor
Input Type:
DC
Isolation Voltage(Vrms):
5kV
Mfr. Part #:
PC-1019-TP1
Package:
LSOP-4
Product Description
Product Overview
The PC-10XX is a photoelectric coupler designed with an integrated light-emitting diode and phototransistor, housed in a 4-pin LSOP 4 package. It offers high input-output isolation voltage (5,000Vrms) and a wide operating temperature range of -55 to 110. Key features include a minimum Current Transfer Ratio (CTR) of 50% at IF = 5mA, VCE = 5V, and compliance with safety approvals such as UL 1577, VDE DIN EN60747-5-5, and CQC11-471543-2022. This RoHS and MSL1 compliant device is suitable for applications in programmable controllers, switching power supplies, intelligent meters, and various home appliances like air conditioners, fans, and water heaters.
Product Attributes
- Brand/Series: PC-10XX (Product Series: 100X, 101X)
- Package Type: 4-pin LSOP 4
- Certifications: UL 1577, VDE DIN EN60747-5-5 (VDE 0884-5), CQC11-471543-2022
- Compliance: RoHS, MSL1
- Lead Frame Material: Copper (Default)
Technical Specifications
| Parameter | Symbol | Values | Unit | Condition |
|---|---|---|---|---|
| Maximum Ratings | ||||
| Input Forward Current | IF | 50 | mA | |
| Reverse Voltage | VR | 6 | V | |
| Power Dissipation | P | 70 | mW | |
| Peak Forward Current | IFP | 1 | A | (100s pulse, 100Hz) |
| Thermal Resistance Junction-Ambient | RthJ-A | 325 | C/W | |
| Thermal Resistance Junction-Case | RthJ-C | 200 | C/W | |
| Output Collector - Emitter Voltage | VCEO | 80 | V | |
| Emitter - Collector Voltage | VECO | 6 | V | |
| Collector Current | IC | 50 | mA | |
| Collector Power Dissipation | PC | 150 | mW | |
| Operating temperature range | Top | -55 ~ 110 | C | |
| Storage temperature range | Tstg | -55 ~ 125 | C | |
| Total Power consumption | P(W) | 200 | mW | |
| Isolation Voltage | VISO | 5000 | Vrms | (AC for 1 minute, R.H.= 40 ~ 60%) |
| Soldering Temperature | TSOL | 260 | C | (For 10 seconds) |
| Electronic Optical Characteristics (TA = 25C) | ||||
| Input Forward Voltage | VF | - 1.2 1.4 | V | IF=20mA |
| Reverse Current | IR | - - 10 | A | VR=4V |
| Terminal Capacitance | Ct | - 30 250 | pF | V=0, f=1KHz |
| Output Collector Dark Current | ICEO | - - 100 | nA | VCE=20V, IF=0 |
| Collector-Emitter Breakdown Voltage | BVCEO | 80 | V | IC=0.1mA, IF=0 |
| Emitter-Collector Breakdown Voltage | BVECO | 7 | V | IE=10A, IF=0 |
| Collector-Emitter Saturation Voltage | VCE(sat) | 0.3 | V | IF=10mA, IC=1mA |
| Isolation Resistance | Riso | 51010 - 11011 | DC500V, 40 ~ 60% R.H. | |
| Floating Capacitance | Cf | 0.6 - 1 | pF | V=0, f=1MHz |
| Response Time (Rise) | tr | 18 | s | VCE=5V, IC=5mA RL=100 |
| Response Time (Fall) | tf | 18 | s | VCE=5V, IC=5mA RL=100 |
| Rank Table Of Current Transfer Ratio (CTR=IC/IF x 100%) | ||||
| Model | Symbol | Min | Max | Condition |
| PC-1010,1000 | CTR | 50 | 600 | IF=5mA, VCE=5V, Ta=25C |
| PC-1017,1007 | CTR | 80 | 160 | IF=5mA, VCE=5V, Ta=25C |
| PC-1018,1008 | CTR | 130 | 260 | IF=5mA, VCE=5V, Ta=25C |
| PC-1019,1009 | CTR | 200 | 400 | IF=5mA, VCE=5V, Ta=25C |
| PC-1012,1002 | CTR | 63 | 125 | IF=10mA, VCE=5V, Ta=25C |
| PC-1013,1003 | CTR | 100 | 200 | IF=10mA, VCE=5V, Ta=25C |
| PC-1014,1004 | CTR | 160 | 320 | IF=10mA, VCE=5V, Ta=25C |
| PC-1012,1002 | CTR | 22 | - | IF=1mA, VCE=5V, Ta=25C |
| PC-1013,1003 | CTR | 34 | - | IF=1mA, VCE=5V, Ta=25C |
| PC-1014,1004 | CTR | 56 | - | IF=1mA, VCE=5V, Ta=25C |
| Outline Dimension (Unit: mm, Tolerance: 0.1mm) | ||||
| [Image of Outline Dimension would be here] | ||||
| Recommended solder pad Design (Unit: mm, Tolerance: 0.1mm) | ||||
| [Image of Recommended solder pad Design would be here] | ||||
| Temperature Profile Of Soldering | ||||
| Method | Profile Item | Condition | ||
| IR Reflow soldering (JEDEC-STD-020 compliant) | Preheat -Temperature Min (TSmin) | 150C | ||
| Preheat -Temperature Max (TSmax) | 200C | |||
| Preheat -Time (min to max) (ts) | 9030 sec | |||
| Soldering zone -Temperature (TL) | 217C | |||
| Soldering zone -Time (tL) | 60 sec | |||
| Peak Temperature (TP) | 260C | |||
| Ramp-up rate | 3C / sec max | |||
| Ramp-down rate | 3~6C/ sec | |||
| Wave soldering (JEDEC22A111 compliant) | [Details not fully specified, refer to JEDEC22A111] | |||
| Hand soldering by soldering iron | Temperature | 380+0/-5C | Time | 3 sec max. |
| Packing | ||||
| Option | Dimension/mm (W, E, F, P0, P1, P2) | Package type:S (160.2, 1.750.1, 7.50.1, 40.1, 80.1, 20.1) | ||
| Option | Dimension/mm (A0, B0, D0, D1, K0, T) | Package type:S (3.95 0.1, 10.82 0.1, 1.50.1, 1.50.1, 2.25 0.1, 0.40.1) | ||
| QTY/PCS | 3K/reel | 6K(2 reels) | 60K | |
2410241625_HENGTUO-PC-1019-TP1_C42368119.pdf
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