Photo Coupler HENGTUO PC-817S1-CTP1-F with High Isolation Voltage and Compliance to Safety Standards
Key Attributes
Model Number:
PC-817S1-CTP1-F
Product Custom Attributes
Fall Time:
3us
Output Current:
50mA
Rise Time:
18us
Vce Saturation(VCE(sat)):
100mV@1mA,20mA
Operating Temperature:
-55℃~+110℃
Load Voltage:
80V
Load Type:
Phototransistor
Reverse Voltage:
6V
Current Transfer Ratio:
50%;600%
Forward Current(If):
50mA
Input Type:
DC
Isolation Voltage(Vrms):
5kV
Number Of Channels:
1
Mfr. Part #:
PC-817S1-CTP1-F
Package:
SMD-4P
Product Description
Product Overview
The PC-817X is a photoelectric coupler designed with an integrated light-emitting diode and phototransistor. Available in a 4-pin package with options for wide-lead spacing and SMD, this device offers high input-output isolation voltage (5,000Vrms) and a wide operating temperature range of -55 to 110. Key features include a minimum Current Transfer Ratio (CTR) of 50% at IF = 5mA, VCE = 5V. The PC-817X is compliant with safety standards such as UL 1577, VDE DIN EN60747-5-5, and CQC11-471543-2022, and is RoHS and MSL1 compliant. It is suitable for applications including programmable controllers, switching power supplies, intelligent meters, and home appliances like air conditioners, fans, and water heaters.
Product Attributes
- Brand/Series: PC-817X (Photo Coupler PC series)
- Certifications: UL 1577, VDE DIN EN60747-5-5 (VDE 0884-5), CQC11-471543-2022
- Compliance: RoHS, MSL1
- Lead Frame Material Options: F (Iron), NONE (Copper)
- Marking: No Marking unless otherwise requested by the customer
Technical Specifications
| Parameter | Symbol | Value | Unit | Condition |
|---|---|---|---|---|
| General Features | ||||
| Current Transfer Ratio (CTR) | CTR | MIN. 50% | % | IF = 5mA, VCE = 5V |
| Input-Output Isolation Voltage | Viso | 5,000 | Vrms | AC for 1 minute, R.H.= 40 ~ 60% |
| Operating Temperature | Top | -55 ~ 110 | ||
| Storage Temperature | Tstg | -55 ~ 125 | ||
| Maximum Ratings | ||||
| Input Forward Current | IF | 50 | mA | |
| Reverse Voltage | VR | 6 | V | |
| Power Dissipation | P | 70 | mW | |
| Peak Forward Current (100s pulse, 100Hz) | IFP | 1 | A | |
| Thermal Resistance Junction-Ambient | RthJ-A | 325 | C/W | |
| Thermal Resistance Junction-Case | RthJ-C | 200 | C/W | |
| Output Collector - Emitter Voltage | VCEO | 80 | V | |
| Emitter - Collector Voltage | VECO | 6 | V | |
| Collector Current | IC | 50 | mA | |
| Collector Power Dissipation | PC | 150 | mW | |
| Total Power Consumption | P(W) | 200 | mW | |
| Soldering Temperature | TSOL | 260 | C | For 10 seconds |
| Electronic Optical Characteristics (TA = 25C) | ||||
| Input Forward Voltage | VF | 1.2 (Typ.) | V | IF=20mA |
| Reverse Current | IR | - | A | VR=4V |
| Terminal Capacitance | Ct | 30 (Typ.) | pF | V=0, f=1KHz |
| Output Collector Dark Current | ICEO | - | nA | VCE=20V, IF=0 |
| Collector-Emitter Breakdown Voltage | BVCEO | 80 | V | IC=0.1mA, IF=0 |
| Emitter-Collector Breakdown Voltage | BVECO | 6 | V | IE=10A, IF=0 |
| Collector-Emitter Saturation Voltage | VCE(sat) | 0.1 (Min.) / 0.2 (Max.) | V | IF=20mA, IC=1mA |
| Isolation Resistance | Riso | 51010 (Min.) | DC500V, 40 ~ 60% R.H. | |
| Floating Capacitance | Cf | 0.6 (Typ.) | pF | V=0, f=1MHz |
| Cut-off Frequency | fc | 80 | kHz | VCE=5V, IC=2mA RL=100,-3dB |
| Response Time (Rise) | tr | 4 (Min.) / 18 (Max.) | s | VCE=2V, IC=2mA RL=100 |
| Response Time (Fall) | tf | 3 (Min.) / 18 (Max.) | s | VCE=2V, IC=2mA RL=100 |
| Rank Table Of Current Transfer Ratio (CTR=IC/IF x 100%) | ||||
| Rank Code | Symbol | Min | Max | Condition |
| NONE | CTR | 50 | 600 | IF=5mA, VCE=5V, Ta=25C |
| A | 80 | 160 | ||
| B | 130 | 260 | ||
| C | 200 | 400 | ||
| D | 300 | 600 | ||
| Product Nomenclature Options | ||||
| Lead Form Option | S1, M, NONE | DIP4-S1, DIP4-M, DIP4 Normal | ||
| CTR Rank | A, B, C, D, E, NONE | |||
| Tape and Reel Option | TP, TP1, NONE | Tape and Reel Type, DIP Type | ||
| Lead frame Material | F, NONE | Iron, Copper | ||
| VDE order option | V | Fixed code | ||
| Halogen free option | G | Fixed code | ||
| Outline Dimensions (DIP Normal Type) | ||||
| Dimension | Unit | Value | Tolerance | |
| Length | mm | 10.4 | 0.1 | |
| Width | mm | 4.6 | 0.1 | |
| Height | mm | 4.6 | 0.1 | |
| Lead Pitch | mm | 2.54 | 0.1 | |
| Outline Dimensions (DIP S1 Type) | ||||
| Dimension | Unit | Value | Tolerance | |
| Length | mm | 10.4 | 0.1 | |
| Width | mm | 4.6 | 0.1 | |
| Height | mm | 4.6 | 0.1 | |
| Lead Pitch | mm | 2.54 | 0.1 | |
| Recommended Solder Pad Design (S1 Type) | ||||
| Dimension | Unit | Value | Tolerance | |
| Pad Width | mm | 1.75 | 0.1 | |
| Pad Length | mm | 7.5 | 0.1 | |
| Pad Spacing | mm | 4 | 0.1 | |
| Pad Offset | mm | 8 | 0.1 | |
| Pad Hole Diameter | mm | 2 | 0.1 | |
2410241625_HENGTUO-PC-817S1-CTP1-F_C42368115.pdf
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