Photoelectric Coupler HENGTUO HT-817S1-ATP1-F Featuring LED and Phototransistor in 4 Pin Package
Key Attributes
Model Number:
HT-817S1-ATP1-F
Product Custom Attributes
Fall Time:
3us
Rise Time:
4us
Output Current:
50mA
Vce Saturation(VCE(sat)):
100mV@1mA,20mA
Operating Temperature:
-55℃~+110℃
Load Voltage:
80V
Reverse Voltage:
6V
Current Transfer Ratio:
80%;160%
Forward Current(If):
50mA
Number Of Channels:
1
Load Type:
Phototransistor
Input Type:
DC
Isolation Voltage(Vrms):
5kV
Mfr. Part #:
HT-817S1-ATP1-F
Package:
SMD-4-S1
Product Description
Product Overview
The HT-817X is a photoelectric coupler featuring a light-emitting diode and phototransistor, available in a 4-pin package with wide-lead spacing and SMD options. It offers high input-output isolation voltage (5,000Vrms), a wide operating temperature range (-55 to 110), and is compliant with safety approvals including UL 1577, VDE DIN EN60747-5-5, and CQC. This RoHS and MSL1 compliant device is suitable for applications such as programmable controllers, switching power supplies, intelligent meters, and home appliances like air conditioners, fans, and water heaters.
Product Attributes
- Brand: Hengtuo Technology Co., LTD.
- Product Series: HT-817X
- Certifications: UL 1577, VDE DIN EN60747-5-5 (VDE 0884-5), CQC11-471543-2022
- Compliance: RoHS, MSL1
- Lead Frame Material Options: Iron (F), Copper (NONE)
- VDE Order Option: V
- Halogen Free Option: G
Technical Specifications
| Parameter | Symbol | Model/Option | Value | Unit | Condition |
|---|---|---|---|---|---|
| Product Nomenclature | HT-817X-X X-X X X-XX | ||||
| Designation | HT | Hengtuo Technology Co.,LTD. | |||
| Product Series | 817 | Product Series | |||
| Lead Form Option | S1 | DIP4-S1 | |||
| M | DIP4-M | ||||
| NONE | DIP4 Normal | ||||
| CTR Rank | A, B, C, D, E | CTR Rank | |||
| NONE | No Rank | ||||
| Tape and Reel Option | TP, TP1 | Tape and Reel Type | |||
| NONE | DIP Type | ||||
| Lead Frame Material | F | Iron | |||
| NONE | Copper | ||||
| VDE Order Option | V | fixed code | |||
| Halogen Free Option | G | fixed code | |||
| Customer Code | XX | Customer code | |||
| Marking Information | HT | Hengtuo | |||
| 817 | Device | ||||
| C | CTR Rank | ||||
| YY | year code | ||||
| WW | week code | ||||
| V | VDE | ||||
| Input Forward Current | IF | 50 | mA | ||
| Reverse Voltage | VR | 6 | V | ||
| Power Dissipation | P | 70 | mW | ||
| Peak Forward Current | IFP | (100s pulse, 100Hz) | 1 | A | |
| Thermal Resistance Junction-Ambient | RthJ-A | 325 | C/W | ||
| Thermal Resistance Junction-Case | RthJ-C | 200 | C/W | ||
| Output Collector - Emitter Voltage | VCEO | 80 | V | ||
| Emitter - Collector Voltage | VECO | 6 | V | ||
| Collector Current | IC | 50 | mA | ||
| Collector Power Dissipation | PC | 150 | mW | ||
| Operating temperature range | Top | -55 ~ 110 | C | ||
| Storage temperature range | Tstg | 55 ~ 125 | C | ||
| Total Power consumption | P(W) | 200 | mW | ||
| Isolation Voltage | VISO | (1) | 5000 | Vrms | AC for 1 minute, R.H.= 40 ~ 60% R.H. Pins 1, 2 shorted; Pins 3, 4 shorted. |
| Soldering Temperature | TSOL | (2) | 260 | C | For 10 seconds |
| Input Forward Voltage | VF | - 1.2 1.4 | V | IF=20mA | |
| Reverse Current | IR | - - 10 | A | VR=4V | |
| Terminal Capacitance | Ct | - 30 250 | pF | V=0, f=1KHz | |
| Collector Dark Current | ICEO | - - 100 | nA | VCE=20V, IF=0 | |
| Collector-Emitter Breakdown Voltage | BVCEO | 80 | V | IC=0.1mA, IF=0 | |
| Emitter-Collector Breakdown Voltage | BVECO | 6 | V | IE=10A, IF=0 | |
| Collector-Emitter Saturation Voltage | VCE(sat) | 0.1 0.2 | V | IF=20mA, IC=1mA | |
| Isolation Resistance | Riso | 51010 11011 | DC500V, 40 ~ 60% R.H. | ||
| Floating Capacitance | Cf | 0.6 1 | pF | V=0, f=1MHz | |
| Cut-off Frequency | fc | 80 | kHz | VCE=5V, IC=2mA RL=100,-3d B | |
| Response Time (Rise) | tr | 4 18 | s | VCE=2V, IC=2mA RL=100 | |
| Response Time (Fall) | tf | 3 18 | s | VCE=2V, IC=2mA RL=100 | |
| Current Transfer Ratio (CTR) | CTR | NONE | 50 600 | IF=5mA, VCE=5V, Ta=25C | |
| A | 80 160 | ||||
| B | 130 260 | ||||
| C | 200 400 | ||||
| D | 300 600 | ||||
| Outline Dimension (DIP Normal Type) | mm | Tolerance: 0.1mm | |||
| Outline Dimension (DIP M Type) | mm | Tolerance: 0.1mm | |||
| Outline Dimension (SMD S1 Type) | mm | Tolerance: 0.1mm | |||
| Recommended Solder Pad Design (S1 Type) | mm | Tolerance: 0.1mm | |||
| IR Reflow Soldering Preheat Temperature Min | TSmin | 150C | |||
| IR Reflow Soldering Preheat Temperature Max | TSmax | 200C | |||
| IR Reflow Soldering Preheat Time | ts | 9030 sec | |||
| IR Reflow Soldering Zone Temperature | TL | 217C | |||
| IR Reflow Soldering Zone Time | tL | 60 sec | |||
| IR Reflow Soldering Peak Temperature | TP | 260C | |||
| IR Reflow Soldering Ramp-up rate | 3C / sec max | ||||
| IR Reflow Soldering Ramp-down rate | 3~6C/ sec | ||||
| Wave Soldering | (JEDEC22A111 compliant) | ||||
| Hand Soldering Temperature | 380+0/-5C | Time: 3 sec max. | |||
| Packing (Tape and Reel Option TP) | 1.5K/reel | PCS | |||
| Packing (Tape and Reel Option TP1) | 3K(2 reels) | PCS | |||
| Packing (Tape and Reel Option TP) Outer Carton | 30K | PCS | |||
| Packing (Tube Option) | 100 | PCS/tube | |||
| Packing (Tube Option) Outer Carton | 50K | PCS | (50 tubes) |
2411261516_HENGTUO-HT-817S1-ATP1-F_C34376183.pdf
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