High density mounting phototransistor optocoupler Broadcom HCPL-817-50DE with UL CSA and IEC approvals

Key Attributes
Model Number: HCPL-817-50DE
Product Custom Attributes
Rise Time:
4us@2mA,100Ω
Output Current:
50mA
Fall Time:
3us@2mA,100Ω
Vce Saturation(VCE(sat)):
100mV@1mA,20mA
Operating Temperature:
-30℃~+100℃
Load Voltage:
70V
Reverse Voltage:
6V
Load Type:
Phototransistor
Input Type:
DC
Number Of Channels:
1
Mfr. Part #:
HCPL-817-50DE
Package:
SOP-4-2.54mm
Product Description

Product Overview

The HCPL-817 is a high-density mounting type phototransistor optocoupler designed for signal transmission between circuits of different potentials and impedances. It features high input-output isolation voltage (Viso = 5000 Vrms), a compact dual-in-line package, and fast response times. This component is ideal for applications such as I/O interfaces for computers and feedback circuits in power supplies. It is available in various lead spacing and surface-mounting options, with UL, CSA, and IEC/EN/DIN EN 60747-5-2 approvals.

Product Attributes

  • Brand: Avago Technologies
  • Certifications: UL approved, CSA approved, IEC/EN/DIN EN 60747-5-2 approved
  • Compliance: RoHS 6 fully compliant options available
  • Package Type: Compact dual-in-line package (DIP-4)
  • Material: Lead (Pb) Free options available

Technical Specifications

Specification Value Details
Current Transfer Ratio (CTR) Min. 50% at IF = 5 mA, VCE = 5 V
Input-Output Isolation Voltage (Viso) 5000 Vrms AC for 1 minute, R.H. = 40 ~ 60%
Response Time (tr) Typ. 4 s at VCE = 2 V, IC = 2 mA, RL = 100
Collector Current (IC) 2.5 - 30 mA IF = 5 mA, VCE = 5 V, RBE =
Collector-Emitter Saturation Voltage (VCE(sat)) Max. 0.2 V IF = 20 mA, IC = 1 mA
Forward Voltage (VF) Max. 1.4 V IF = 20 mA
Collector Dark Current (ICEO) Max. 100 nA VCE = 20 V
Collector-Emitter Breakdown Voltage (BVCEO) Min. 70 V IC = 0.1 mA
Emitter-Collector Breakdown Voltage (BVECO) Min. 6 V IE = 10 A
Cut-off Frequency (fc) Typ. 80 KHz VCC = 5 V, IC = 2 mA, RL = 100 , 3 dB
Isolation Resistance (Riso) Min. 5 x 1010 DC 500 V, 40 ~ 60% R.H.
Operating Temperature 30C to +100C TA
Storage Temperature 55C to +125C TS
Lead Solder Temperature 260C for 10 s (1.6 mm below seating plane)
Average Forward Current (IF) Max. 50 mA
Input Power Dissipation (PI) Max. 70 mW
Collector Current (IC) Max. 50 mA
Collector-Emitter Voltage (VCEO) Max. 70 V
Emitter-Collector Voltage (VECO) Max. 6 V
Collector Power Dissipation Max. 150 mW
Total Power Dissipation Max. 200 mW
Package Dimensions (DIP-4) 7.62 mm (0.3") lead spacing (standard) 10.16 mm (0.4") lead spacing (W00 option)
Ordering Information Example HCPL-817-360E 300mil DIP-4, Gull Wing Surface Mount, Tube, 50%<CTR<600%, IEC/EN/DIN EN 60767-5-2, RoHS compliant.
Ordering Information Example HCPL-817-50BE 300mil DIP-4, Gull Wing Surface Mount, Tape and Reel, 130%<CTR<260%, RoHS compliant.

2410121933_Broadcom-HCPL-817-50DE_C961426.pdf

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