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quality Single channel high speed optocoupler Broadcom HCNW136-000E with ul csa and iec en 60747 5 5 approvals factory
quality Single channel high speed optocoupler Broadcom HCNW136-000E with ul csa and iec en 60747 5 5 approvals factory

Single channel high speed optocoupler Broadcom HCNW136-000E with ul csa and iec en 60747 5 5 approvals

Key Attributes
Model Number: HCNW136-000E
Product Custom Attributes
Output Current:
8mA
Fall Time:
1.5us
Operating Temperature:
-55℃~+85℃
Load Voltage:
15V
Reverse Voltage:
3V
Current Transfer Ratio:
19%;50%
Input Type:
DC
Isolation Voltage(Vrms):
5kV
Number Of Channels:
1
Mfr. Part #:
HCNW136-000E
Package:
DIP-8
Product Description

Broadcom 6N135/6, HCNW135/6, HCPL-2502/0500/0501 Single-Channel, High-Speed Optocouplers

Product Overview

These diode-transistor optocouplers provide electrical insulation between input and output using an insulating layer between an LED and an integrated photodetector. Featuring separate connections for photodiode bias and output-transistor collector, they achieve speeds up to a hundred times faster than conventional phototransistor couplers by reducing base-collector capacitance. Available in 8-pin DIP, SO-8, and Widebody package configurations, these single-channel optocouplers are suitable for TTL/CMOS, TTL/LSTTL, wide-bandwidth analog, and high-speed TTL/TTL applications. They offer high speed (1 Mb/s), TTL compatibility, open collector output, and safety approvals including UL Recognition, CSA Approval, and IEC/EN/DIN EN 60747-5-5 approval.

Product Attributes

  • Brand: Broadcom
  • Product Series: 6N135/6, HCNW135/6, HCPL-2502/0500/0501
  • Certifications: UL Recognized, CSA Approved, IEC/EN/DIN EN 60747-5-5 Approved

Technical Specifications

Model/Part Number Package Type Description Current Transfer Ratio (CTR) Minimum Speed UL Recognition IEC/EN/DIN EN 60747-5-5 VIORM
6N135, HCPL-0500, HCNW135 8-pin DIP, SO-8, Widebody For TTL/CMOS, TTL/LSTTL or wide-bandwidth analog applications 7% at IF = 16 mA 1 Mb/s 3750 Vrms for 1 minute (UL1577) N/A (See specific options)
6N136, HCPL-2502, HCPL-0501, HCNW136 8-pin DIP, SO-8, Widebody For high-speed TTL/TTL applications 19% at IF = 16 mA 1 Mb/s 3750 Vrms for 1 minute (UL1577) N/A (See specific options)
HCNW135/6 8-pin DIP (400 Mil Widebody) High speed, high voltage insulation 19% minimum at IF = 16 mA 1 Mb/s 5000 Vrms for 1 minute (UL1577) 630V peak for DIP 300 mil devices; 1414V peak for DIP 400 mil (widebody) devices
HCPL-0500/0501 SO-8 High speed, TTL compatible 7% (HCPL-0500), 19% (HCPL-0501) at IF = 16 mA 1 Mb/s 3750 Vrms for 1 minute (UL1577) 567V peak for SO-8 devices
HCPL-2502 8-pin DIP (300 Mil) High speed, TTL compatible 15% minimum at IF = 16 mA (JEDEC), 19% guaranteed (Avago) 1 Mb/s 3750 Vrms for 1 minute (UL1577) N/A (See specific options)
Option 020 (8-Pin DIP) 8-Pin DIP High voltage insulation N/A N/A 5000 Vrms for 1 minute (UL1577) N/A
Option 060 (8-Pin DIP/SO-8) 8-Pin DIP, SO-8 IEC/EN/DIN EN 60747-5-5 Approved N/A N/A N/A 630V peak (DIP), 567V peak (SO-8)
Option 060 (Widebody) Widebody DIP IEC/EN/DIN EN 60747-5-5 Approved N/A N/A N/A 1414V peak

Applications

  • High voltage insulation
  • Video signal isolation
  • Line receivers
  • Feedback element in switched mode power supplies
  • High speed logic ground isolation (TTL/TTL, TTL/CMOS, TTL/LSTTL)
  • Replaces pulse transformers
  • Replaces slow phototransistor isolators
  • Analog signal ground isolation

Features

  • High speed: 1 Mb/s
  • TTL compatible
  • Available in 8-pin DIP, SO-8, widebody packages
  • Open collector output
  • Safety approval: UL Recognized, CSA Approved, IEC/EN/DIN EN 60747-5-5 Approved

Package Outline Drawings

Refer to the datasheet for detailed package outline drawings for 8-Pin DIP, 8-Pin DIP with Gull Wing Surface Mount, Small Outline SO-8, and 8-Pin Widebody DIP packages.

Insulation and Safety Related Specifications

Parameter Symbol 8-Pin DIP (300 Mil) Value SO-8 Value Widebody (400 Mill) Value Units Conditions
Minimum External Air Gap (External Clearance) L(101) 7.1 4.9 9.6 mm Measured from input terminals to output terminals, shortest distance through air.
Minimum External Tracking (External Creepage) L(102) 7.4 4.8 10.0 mm Measured from input terminals to output terminals, shortest distance path along body.
Minimum Internal Plastic Gap (Internal Clearance) 0.08 0.08 1.0 mm Through insulation distance conductor to conductor.
Minimum Internal Tracking (Internal Creepage) N/A N/A 4.0 mm Measured from input terminals to output terminals, along internal cavity.
Tracking Resistance (Comparative Tracking Index) CTI 200 200 200 V DIN IEC 112/VDE 0303 Part 1
Input-Output Momentary Withstand Voltage VISO 3750 3750 5000 Vrms RH < 50%, t = 1 min., TA = 25C (UL 1577)

IEC/EN/DIN EN 60747-5-5 Insulation Characteristics

Description Symbol 8-Pin DIP/SO-8 Value Widebody (400 Mill) Value Units Conditions
Maximum Working Insulation Voltage VIORM 567 (SO-8), 630 (DIP) 1414 Vpeak Installation Classification per DIN VDE 0110/39
Input to Output Test Voltage, Method ba VPR 1063 (SO-8), 1181 (DIP) 2651 Vpeak 100% Production Test with tm = 1s, Partial Discharge < 5 pC
Input to Output Test Voltage, Method aa VPR 907 (SO-8), 1008 (DIP) 2262 Vpeak Type and Sample Test, tm = 10s, Partial Discharge < 5 pC
Highest Allowable Overvoltage (Transient Overvoltage) VIOTM 6000 (SO-8), 8000 (DIP) 8000 Vpeak tini = 60s

Absolute Maximum Ratings

Parameter Symbol Device Min. Max. Units Note
Storage Temperature TS All -55 125 C a
Operating Temperature TA 8-Pin DIP, SO-8 -55 100 C a
Operating Temperature TA Widebody -55 85 C a
Average Forward Input Current IF(AVG) All 25 mA b
Peak Forward Input Current (50% duty cycle, 1-ms pulse width) IF(PEAK) 8-Pin DIP, SO-8 50 mA c
Peak Forward Input Current (50% duty cycle, 1-ms pulse width) IF(PEAK) Widebody 40 mA c
Reverse LED Input Voltage VR 8-Pin DIP, SO-8 5 V a
Reverse LED Input Voltage VR Widebody 3 V a
Input Power Dissipation PIN 8-Pin DIP, SO-8 45 mW d
Input Power Dissipation PIN Widebody 40 mW d
Average Output Current IO(AVG) All 8 mA
Peak Output Current IO(PEAK) All 16 mA
Emitter-Base Reverse Voltage VEBR All 5 V
Supply Voltage VCC 8-Pin DIP, SO-8 -0.5 30 V
Output Voltage VO 8-Pin DIP, SO-8 -0.5 20 V
Supply Voltage VCC Widebody -0.5 15 V a
Output Voltage VO Widebody -0.5 15 V a
Base Current IB All 5 mA
Output Power Dissipation PO All 100 mW e
Lead Solder Temperature (Through-Hole Parts Only) TLS 8-Pin DIP, Widebody 260 C 1.6 mm below seating plane, 10s

Electrical Specifications (DC)

Parameter Symbol Device Min. Typ. Max. Units Test Conditions Figure Note
Current Transfer Ratio CTR 6N135, HCPL-0500, HCNW135 7 18 50 % TA = 25C, VO = 0.4V, IF = 16 mA, VCC = 4.5V 1, 2, 4 c, d
Current Transfer Ratio CTR 6N136, HCPL-2502, HCPL-0501, HCNW136 19 24 50 % TA = 25C, VO = 0.4V, IF = 16 mA, VCC = 4.5V 1, 2, 4 c, d
Logic Low Output Voltage VOL 6N135, HCPL-0500, HCNW135 0.1 0.4 V TA = 25C, IO = 1.1 mA, IF = 16 mA, VCC = 4.5V
Logic Low Output Voltage VOL 6N136, HCPL-2502, HCPL-0501, HCNW136 0.1 0.4 V TA = 25C, IO = 3.0 mA, IF = 16 mA, VCC = 4.5V
Logic High Output Current IOH All 0.003 0.5 A TA = 25C, VO = VCC = 5.5V, IF = 0 mA 7
Logic Low Supply Current ICCL All 50 200 A IF = 16 mA, VO = Open, VCC = 15V
Logic High Supply Current ICCH All 0.02 1 A TA = 25C, IF = 0 mA, VO = Open, VCC = 15V
Input Forward Voltage VF 8-Pin DIP 1.5 1.7 V TA = 25C, IF = 16 mA 3 b
Input Forward Voltage VF SO-8 1.8 V TA = 25C, IF = 16 mA 3 b
Input Forward Voltage VF Widebody 1.45 1.68 1.85 V TA = 25C, IF = 16 mA 3 b
Input Reverse Breakdown Voltage BVR 8-Pin DIP 5 V IR = 10 A b
Input Reverse Breakdown Voltage BVR SO-8, Widebody 3 V IR = 100 A b
Temperature Coefficient of Forward Voltage VF/TA 8-Pin DIP -1.6 mV/C IF = 16 mA
Input Capacitance CIN 8-Pin DIP 60 pF f = 1 MHz, VF = 0V f
Input Capacitance CIN SO-8, Widebody 90 pF f = 1 MHz, VF = 0V f

Switching Specifications (AC)

Parameter Symbol Device Min. Typ. Max. Units Test Conditions Figure Note
Propagation Delay Time to Logic Low at Output tPHL 6N135, HCPL-0500, HCNW135 0.2 1.5 s TA = 25C, RL = 4.1 k 5, 6, 11 c, d
Propagation Delay Time to Logic Low at Output tPHL 6N136, HCPL-2502, HCPL-0501, HCNW136 0.2 0.8 s TA = 25C, RL = 1.9 k 5, 6, 11 c, d
Propagation Delay Time to Logic High at Output tPLH 6N135, HCPL-0500, HCNW135 1.3 1.5 s TA = 25C, RL = 4.1 k 5, 6, 11 c, d
Propagation Delay Time to Logic High at Output tPLH 6N136, HCPL-2502, HCPL-0501, HCNW136 0.6 0.8 s TA = 25C, RL = 1.9 k 5, 6, 11 c, d
Common Mode Transient Immunity at Logic High Level Output |CMH| 6N135, HCPL-0500, HCNW135 1 kV/s RL = 4.1 k, IF = 0 mA, TA = 25C, VCM = 10 Vp-p, CL = 15 pF 12 c, d, e
Common Mode Transient Immunity at Logic High Level Output |CMH| 6N136, HCPL-2502, HCPL-0501 1 kV/s RL = 1.9 k, IF = 0 mA, TA = 25C, VCM = 10 Vp-p, CL = 15 pF 12 c, d, e
Common Mode Transient Immunity at Logic Low Level Output |CML| 6N135, HCPL-0500, HCNW135 1 kV/s RL = 4.1 k, IF = 16 mA, TA = 25C, CL = 15 pF 12 c, d, e
Common Mode Transient Immunity at Logic Low Level Output |CML| 6N136, HCPL-2502, HCPL-0501 1 kV/s RL = 1.9 k, IF = 16 mA, TA = 25C, CL = 15 pF 12 c, d, e
Bandwidth BW 6N135/6, HCPL-2502, HCPL-0500/1 9 MHz See Test Circuit 8, 10 f
Bandwidth BW HCNW135/6 11 MHz See Test Circuit 8, 10 f

Package Characteristics

Parameter Symbol Device Min. Typ. Max. Units Test Conditions Note
Input-Output Momentary Withstand Voltage VISO 8-Pin DIP, SO-8 3750 Vrms RH < 50%, t = 1 min., TA = 25C c, d
Input-Output Momentary Withstand Voltage VISO Widebody 5000 Vrms RH < 50%, t = 1 min., TA = 25C c, e
Input-Output Momentary Withstand Voltage VISO 8-Pin DIP (Option 020) 5000 Vrms RH < 50%, t = 1 min., TA = 25C c, e, f
Input-Output Leakage Current II-O 8-Pin DIP 1 A 45% RH, t = 5s, VI-O = 3 kVdc, TA = 25C c, g
Input-Output Resistance RI-O 8-Pin DIP, SO-8 1012 VI-O = 500 Vdc c
Input-Output Resistance RI-O Widebody 1012 1013 TA = 25C c
Input-Output Resistance RI-O Widebody 1011 TA = 100C c
Input-Output Capacitance CI-O 8-Pin DIP, SO-8 0.6 pF f = 1 MHz c
Input-Output Capacitance CI-O Widebody 0.5 0.6 pF f = 1 MHz c

Notes on Figures

The datasheet includes figures illustrating:

  • Figure 1: DC and Pulsed Transfer Characteristics
  • Figure 2: Current Transfer Ratio vs. Input Current
  • Figure 3: Input Current vs. Forward Voltage
  • Figure 4: Current Transfer Ratio vs. Temperature
  • Figure 5: Propagation Delay vs. Temperature
  • Figure 6: Propagation Delay Time vs. Load Resistance
  • Figure 7: Logic High Output Current vs. Temperature
  • Figure 8: Small-Signal Current Transfer Ratio vs. Quiescent Input Current
  • Figure 9: Thermal Derating Curve, Dependence of Safety Limiting Value with Case Temperature per IEC/EN/DIN EN 60747-5-5
  • Figure 10: Frequency Response
  • Figure 11: Switching Test Current
  • Figure 12: Test Circuit for Transient Immunity and Typical Waveforms

CAUTION

Normal static precautions should be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.


2411271955_Broadcom-HCNW136-000E_C6795879.pdf

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