switching optocoupler Broadcom QCPL-329J-500E with failure in time and mean time to failure metrics
Product Overview
This document presents reliability data for Broadcom's Smart Gate Drive Optocoupler family, including models HCPL-316J, ACPL-331J/332J, ACPL-330J/333J, and QCPL-325J/329J. The data is derived from Broadcom's internal testing, utilizing similar wafer technology and adhering to strict internal processes, material specifications, design standards, and statistical process controls. These optocouplers are designed for applications requiring reliable switching performance, with failure defined as the inability to switch ON with twice the minimum recommended drive current or switch OFF with no input current. The reliability data, presented in terms of Mean Time To Failure (MTTF) and Failures In Time (FIT), is based on high-temperature operating life tests and assumes an exponential failure distribution. It is important to note that the provided reliability data is specific to Broadcom devices and may not be directly transferable to similar part types from other manufacturers due to differences in testing conditions and factors accounted for. Users are advised to consider their specific application's total power and duty cycle when comparing these results with predictions from standards like MIL-HDBK-217.
Product Attributes
- Brand: Broadcom
- Technology: Similar wafer technology across the product family.
- Testing Basis: Broadcom internal processes, material specifications, design standards, and statistical process controls.
Technical Specifications
Demonstrated Operating Life Test Performance
| Test Condition | Total Device Tested | Total Device Hours | Number of Failed Units | Demonstrated MTTF(hr) at TA = +125C | Demonstrated FITs at TA = +125C |
|---|---|---|---|---|---|
| TA = 125C VCC Bias (Based on DS) | 984 | 984,000 | 0 | 984,000 | 1,016 |
Reliability Projection for Devices Listed in Title
| Ambient Temperature (C) | Junction Temperature (C) | Typical (60% Confidence) | 90% Confidence | ||
|---|---|---|---|---|---|
| MTTF (Hr/Fail) | FITs (Fail/109h) | MTTF (Hr/Fail) | FITs (Fail/109h) | ||
| 125 | 140 | 1,073,895 | 931 | 427,346 | 2,340 |
| 120 | 135 | 1,245,007 | 803 | 495,438 | 2,018 |
| 110 | 125 | 1,692,121 | 591 | 673,363 | 1,485 |
| 100 | 115 | 2,336,469 | 428 | 929,775 | 1,076 |
| 90 | 105 | 3,281,731 | 305 | 1,305,932 | 766 |
| 80 | 95 | 4,695,313 | 213 | 1,868,453 | 535 |
| 70 | 85 | 6,853,569 | 146 | 2,727,309 | 367 |
| 60 | 75 | 10,223,715 | 98 | 4,068,425 | 246 |
| 50 | 65 | 15,616,306 | 64 | 6,214,353 | 161 |
| 40 | 55 | 24,477,415 | 41 | 9,740,543 | 103 |
| 30 | 45 | 39,466,509 | 25 | 15,705,303 | 64 |
| 25 | 40 | 50,691,071 | 20 | 20,172,005 | 50 |
Preconditioning: MSL 1 using a solder reflow process (260C peak temperature) and 20 temperature cycles (55C to +125C, 15 mins dwell, 1 min transfer).
Failure Definition: Inability to switch ON with twice the minimum recommended drive current (but not exceeding maximum rating) or failure to switch OFF when there is no input current.
Failure Rate Projection Basis: Arrhenius acceleration relationship with a 0.43 eV activation energy.
2410010204_Broadcom-QCPL-329J-500E_C692109.pdf
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