Digital Isolation Solutions Including Broadcom HCPL 902J 500E for Peripheral Interface Applications
Broadcom HCPL-90xx / HCPL-09xx High-Speed Digital Isolators
Product Overview
The Broadcom HCPL-90xx and HCPL-09xx series are high-speed CMOS digital isolators designed for robust performance and excellent transient immunity. Featuring a symmetric magnetic coupling barrier, these isolators offer industry-leading speed with a typical pulse width distortion of 2 ns, a typical propagation delay skew of 4 ns, and a data rate of 100 Mbaud. Available in various channel configurations (single, dual, and quad) and package types, they are ideal for isolating data conversion devices, parallel buses, peripheral interfaces, and digital fieldbus applications. They operate across a wide temperature range of 40C to +100C.
Product Attributes
- Brand: Broadcom
- Technology: CMOS Digital Isolators
- Certifications: UL1577, IEC 61010-1
Technical Specifications
| Model Series | Channel Configuration | Package Type | Data Rate | Pulse Width Distortion (Typ.) | Propagation Delay Skew (Typ.) | Isolation Voltage (RMS) | Operating Temperature |
|---|---|---|---|---|---|---|---|
| HCPL-90xx / HCPL-09xx | Single | 8-pin PDIP (300 Mil), 8-pin SOIC | 100 Mbaud | 2 ns | 4 ns | 2500V | -40C to +100C |
| HCPL-90xx / HCPL-09xx | Dual (Unidirectional) | 8-pin DIP (300 Mil), 8-pin SOIC | 100 Mbaud | 2 ns | 4 ns | 2500V | -40C to +100C |
| HCPL-90xx / HCPL-09xx | Dual (Bidirectional) | 8-pin DIP (300 Mil), 8-pin SOIC | 100 Mbaud | 2 ns | 4 ns | 2500V | -40C to +100C |
| HCPL-90xx / HCPL-09xx | Quad (Unidirectional) | 16-pin SOIC Wide Body, 16-pin SOIC Narrow Body | 100 Mbaud | 2 ns | 4 ns | 2500V | -40C to +100C |
| HCPL-90xx / HCPL-09xx | Quad (2 channels one direction, 2 opposite) | 16-pin SOIC Wide Body, 16-pin SOIC Narrow Body | 100 Mbaud | 2 ns | 4 ns | 2500V | -40C to +100C |
| HCPL-90xx / HCPL-09xx | Quad (1 channel one direction, 3 opposite) | 16-pin SOIC Wide Body, 16-pin SOIC Narrow Body | 100 Mbaud | 2 ns | 4 ns | 2500V | -40C to +100C |
Key Features
- +3.3V and +5V TTL/CMOS compatible
- 3 ns max. pulse width distortion
- 6 ns max. propagation delay skew
- 15 ns max. propagation delay
- High speed: 100 MBd
- 15 kV/s min. common mode rejection
- Tri-state output (HCPL-9000/-0900)
- 2500V RMS isolation
Applications
- Digital fieldbus isolation
- Multiplexed data transmission
- Computer peripheral interface
- High-speed digital systems
- Isolated data interfaces
- Logic level shifting
Electrical Specifications (Typical @ +25C, VDD1 = VDD2 = +3.3V)
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Test Conditions |
|---|---|---|---|---|---|---|
| Quiescent Supply Current 1 | IDD1 | - | 0.008 (HCPL-9000/-0900) | 0.01 (HCPL-9000/-0900) | mA | VIN = 0V |
| Quiescent Supply Current 2 | IDD2 | - | 3.3 (HCPL-9000/-0900) | 4.0 (HCPL-9000/-0900) | mA | VIN = 0V |
| Logic Input Current | IIN | -10 | - | 10 | A | - |
| Logic High Output Voltage | VOH | VDD2 0.1 | - | VDD2 | V | IOUT = 20 A, VIN = VIH |
| Logic Low Output Voltage | VOL | - | 0 | 0.1 | V | IOUT = 20 A, VIN = VIL |
Switching Specifications (Typical @ +25C, VDD1 = VDD2 = +3.3V)
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Test Conditions |
|---|---|---|---|---|---|---|
| Maximum Data Rate | - | 100 | 110 | - | MBd | CL = 15 pF |
| Propagation Delay Time to Logic Low Output | tPHL | - | 12 | 18 | ns | - |
| Propagation Delay Time to Logic High Output | tPLH | - | 12 | 18 | ns | - |
| Pulse Width Distortion | |PWD| | - | 2 | 3 | ns | |tPHL tPLH| |
| Propagation Delay Skew | tPSK | - | 4 | 6 | ns | - |
| Common Mode Transient Immunity | |CMH|, |CML| | 15 | 18 | - | kV/s | Vcm = 1000V |
Package Characteristics
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Test Conditions |
|---|---|---|---|---|---|---|
| Capacitance (Input-Output) | CI-O | - | 1.1 (Single Channel) | - | pF | f = 1 MHz |
| Barrier Resistance || Capacitance | - | >1014 | 3 | - | || pF | - |
| Creepage Distance (External) | - | 4.03 (16-Pin SOIC Narrow) | - | - | mm | - |
| Leakage Current | - | - | 0.2 | - | A | 240 Vrms, 60 Hz |
Package Outline Drawings
Refer to the datasheet for detailed package outline drawings for 8-pin PDIP, 8-pin Gull Wing, 8-pin SOIC, and 16-pin SOIC (narrow and wide body) packages.
Handling Precautions
Take normal static precautions in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. The components featured in this data sheet are not to be used in military or aerospace applications or environments.
2411271956_Broadcom-HCPL-902J-500E_C6873793.pdf
Our mission is to offer "High Quality" & "Good Service" & "Fast Delivery" to help our clients to gain more profits.
