Robust CMOS digital isolator Broadcom HCPL-9000-500 with UL1577 and IEC 61010-1 safety certifications

Key Attributes
Model Number: HCPL-9000-500
Product Custom Attributes
CMTI(kV/us):
18kV/us
Default Output:
-
Number Of Forward Channels:
1
Operating Temperature:
-40℃~+100℃
Mfr. Part #:
HCPL-9000-500
Package:
DIP-8
Product Description

Broadcom HCPL-90xx and HCPL-09xx High-Speed Digital Isolators

Product Overview

The Broadcom HCPL-90xx and HCPL-09xx series are high-speed CMOS digital isolators designed for robust performance and excellent transient immunity. Featuring a symmetric magnetic coupling barrier, these devices offer industry-leading speed with a typical pulse width distortion of 2 ns, a typical propagation delay skew of 4 ns, and a 100 Mbaud data rate. Available in single, dual, and quad-channel configurations, they are ideal for isolating data conversion devices, parallel buses, peripheral interfaces, and digital fieldbus applications. These isolators are compatible with 3.3V and 5V TTL/CMOS logic and are specified for operation over a wide temperature range of 40C to +100C.

Product Attributes

  • Brand: Broadcom
  • Technology: CMOS Digital Isolators
  • Certifications: UL1577, IEC 61010-1

Technical Specifications

Model Series Channel Configuration Package Type Data Rate Isolation Voltage Max. Pulse Width Distortion Max. Propagation Delay Skew Max. Propagation Delay Common Mode Rejection Operating Temperature
HCPL-90xx / HCPL-09xx Single 8-pin PDIP (300 Mil), 8-pin SOIC 100 MBd 2500V RMS 3 ns 6 ns 15 ns 15 kV/s min. 40C to +100C
HCPL-90xx / HCPL-09xx Dual (Unidirectional) 8-pin DIP (300 Mil), 8-pin SOIC 100 MBd 2500V RMS 3 ns 6 ns 15 ns 15 kV/s min. 40C to +100C
HCPL-90xx / HCPL-09xx Dual (Bidirectional) 8-pin DIP (300 Mil), 8-pin SOIC 100 MBd 2500V RMS 3 ns 6 ns 15 ns 15 kV/s min. 40C to +100C
HCPL-90xx / HCPL-09xx Quad (Unidirectional) 16-pin SOIC Wide Body, 16-pin SOIC Narrow Body 100 MBd 2500V RMS 3 ns 6 ns 15 ns 15 kV/s min. 40C to +100C
HCPL-90xx / HCPL-09xx Quad (2 channels one direction, 2 opposite) 16-pin SOIC Wide Body, 16-pin SOIC Narrow Body 100 MBd 2500V RMS 3 ns 6 ns 15 ns 15 kV/s min. 40C to +100C
HCPL-90xx / HCPL-09xx Quad (1 channel one direction, 3 opposite) 16-pin SOIC Wide Body, 16-pin SOIC Narrow Body 100 MBd 2500V RMS 3 ns 6 ns 15 ns 15 kV/s min. 40C to +100C
Logic Compatibility: +3.3V and +5V TTL/CMOS compatible
Tri-state Output: Available on HCPL-9000/-0900
Output Enable: Active-low logic output enable on single-channel devices (HCPL-9000/-0900)
Package Options: 8-pin PDIP, 8-pin Gull Wing, 8-pin SOIC, 16-pin SOIC narrow-body, 16-pin SOIC wide-body

Applications

  • Digital fieldbus isolation
  • Multiplexed data transmission
  • Computer peripheral interface
  • High-speed digital systems
  • Isolated data interfaces
  • Logic level shifting

Package Characteristics

Parameter 8-Pin PDIP 8-Pin SOIC 16-Pin SOIC Narrow Body 16-Pin SOIC Wide Body Unit
Thermal Resistance (JCT) 54 144 41 28 C/W
Package Power Dissipation (PPD) 150 150 150 150 mW
Creepage Distance (External) 7.04 4.04 4.03 8.08 mm

Insulation and Safety Related Specifications

Parameter Condition Min. Typ. Max. Unit
Barrier Resistance || Capacitance >1014 3 (Single) / 7 (Quad) || pF
Leakage Current 240 Vrms, 60 Hz 0.2 A
Installation Classification (DIN VDE 0110/1.89) For Rated Mains Voltage 150 Vrms I III
Installation Classification (DIN VDE 0110/1.89) For Rated Mains Voltage 300 Vrms I III
Pollution Degree (DIN VDE 0110/1.89) 2
Maximum Working Insulation Voltage (VIORM) 150 / 300 Vrms

Recommended Operating Conditions

Parameter Min. Max. Unit
Ambient Operating Temperature (TA) 40 100 C
Supply Voltage (VDD1, VDD2) 3.0 5.5 V
Logic High Input Voltage (VIH) 2.4 VDD1 V
Logic Low Input Voltage (VIL) 0 0.8 V
Input Signal Rise and Fall Times (tIR, tIF) 1 s

Electrical Specifications (Typical at TA = +25C)

3.3V Operation

Parameter Model Min. Typ. Max. Unit Test Conditions
Quiescent Supply Current 1 (IDD1) HCPL-9000/-0900 0.008 0.01 mA VIN = 0V
HCPL-9030/-0930 0.008 0.01 mA VIN = 0V
HCPL-9031/-0931 1.5 2.0 mA VIN = 0V
HCPL-900J/-090J 0.018 0.02 mA VIN = 0V
HCPL-901J/-091J 3.3 4.0 mA VIN = 0V
HCPL-902J/-092J 1.5 2.0 mA VIN = 0V
Quiescent Supply Current 2 (IDD2) HCPL-9000/-0900 3.3 4.0 mA VIN = 0V
HCPL-9030/-0930 3.3 4.0 mA VIN = 0V
HCPL-9031/-0931 1.5 2.0 mA VIN = 0V
HCPL-900J/-090J 5.5 8.0 mA VIN = 0V
HCPL-901J/-091J 3.3 4.0 mA VIN = 0V
HCPL-902J/-092J 3.0 6.0 mA VIN = 0V
Logic Input Current (IIN) All 10 10 A
Logic High Output Voltage (VOH) IOUT = 20 A, VIN = VIH VDD2 0.1 VDD2 V
IOUT = 4 mA, VIN = VIH 0.8 * VDD2 VDD2 0.5 V
Logic Low Output Voltage (VOL) IOUT = 20 A, VIN = VIL 0 0.1 V
IOUT = 4 mA, VIN = VIL 0.5 0.8 V

5V Operation

Parameter Min. Typ. Max. Unit Test Conditions
Maximum Data Rate 100 110 MBd CL = 15 pF
Clock Frequency (fmax) 50 MHz
Propagation Delay Time to Logic Low Output (tPHL) 12 18 ns
Propagation Delay Time to Logic High Output (tPLH) 12 18 ns
Pulse Width (tPW) 10 ns
Pulse Width Distortion (PWD) 2 3 ns |tPHL tPLH|
Propagation Delay Skew (tPSK) 4 6 ns
Output Rise Time (tR) 2 4 ns (10% to 90%)
Output Fall Time (tF) 2 4 ns (10% to 90%)
Propagation Delay Enable to Output (Single Channel) High to High Impedance (tPHZ) 3 5 ns
Low to High Impedance (tPLZ) 3 5 ns
High Impedance to High (tPZH) 3 5 ns
High Impedance to Low (tPZL) 3 5 ns
Channel-to-Channel Skew (Dual and Quad Channels) 2 3 ns (tCSK)
Common Mode Transient Immunity |CMH|, |CML| 15 18 kV/s Vcm = 1000V

Application Information

Power Consumption

The HCPL-90xx and HCPL-09xx digital isolators achieve low power consumption by detecting input logic signal edge transitions and converting them into narrow current pulses to drive the isolation barrier. The output latch then reconstructs the signal. Power consumption is frequency-dependent and independent of the mark-to-space ratio. Approximate supply current per channel: I(Input) = 40(f/fmax)(1/4) mA, where f = operating frequency and fmax = 50 MHz.

Signal Status on Start-up and Shut Down

To minimize power dissipation, input signals are differentiated and latched. This can lead to ambiguous output states during power-up, shutdown, or power loss. Designers should consider including an initialization signal in the start-up circuit by toggling the input high then low, or low then high.

Bypassing and PC Board Layout

These digital isolators are designed for ease of use with no external interface circuitry required. High-speed CMOS IC technology allows direct connection to CMOS logic inputs and outputs. For proper operation, low ESR 47 nF ceramic capacitors are recommended for power supply decoupling, placed as close as possible to the VDD pins. Ground planes for both GND1 and GND2 are highly recommended for data rates above 10 Mb/s.

Propagation Delay, Pulse Width Distortion, and Propagation Delay Skew

Propagation delay (tPLH, tPHL) measures signal transit time. Pulse Width Distortion (PWD) is the difference between tPHL and tPLH, impacting maximum data rate. Propagation Delay Skew (tPSK) and Channel-to-Channel Skew (tCSK) are critical for parallel data transmission, ensuring signal synchronization. tPSK is the difference in propagation delays between devices, while tCSK is the difference within channels of a single device. In parallel applications, the absolute minimum pulse width is typically twice tPSK to avoid data corruption.


2411271956_Broadcom-HCPL-9000-500_C6955786.pdf

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