Broadcom HCPL 901J digital isolators offering multiple channel configurations for versatile industrial

Key Attributes
Model Number: HCPL-901J
Product Custom Attributes
CMTI(kV/us):
18kV/us
Default Output:
-
Number Of Forward Channels:
2
Number Of Reverse Channels:
2
Operating Temperature:
-40℃~+100℃
Mfr. Part #:
HCPL-901J
Package:
SOIC-16-300mil
Product Description

Product Overview

The Broadcom HCPL-90xx and HCPL-09xx series are high-speed CMOS digital isolators designed for superior performance and transient immunity. Featuring a symmetric magnetic coupling barrier, these isolators offer industry-leading speed with a typical pulse width distortion of 2 ns, a typical propagation delay skew of 4 ns, and a 100 Mbaud data rate. Available in single, dual, and quad-channel configurations, they are ideal for isolating data conversion devices, parallel buses, peripheral interfaces, and digital fieldbus applications. These devices are specified for operation over a wide temperature range of 40C to +100C and are available in various package types including 8-pin PDIP, 8-pin Gull Wing, 8-pin SOIC, and 16-pin SOIC (narrow and wide body).

Product Attributes

  • Brand: Broadcom
  • Technology: CMOS Digital Isolators
  • Certifications: UL1577, IEC 61010-1
  • ESD Sensitivity: Requires normal static precautions
  • Not for: Military or aerospace applications

Technical Specifications

Model Series Channels Package Type Data Rate Pulse Width Distortion (Typ.) Propagation Delay Skew (Typ.) Isolation Voltage (RMS) Operating Temperature
HCPL-90xx / HCPL-09xx Single 8-pin PDIP, 8-pin SOIC 100 Mbaud 2 ns 4 ns 2500 VRMS -40C to +100C
HCPL-90xx / HCPL-09xx Dual (Unidirectional) 8-pin DIP (300 Mil), 8-pin SOIC 100 Mbaud 2 ns 4 ns 2500 VRMS -40C to +100C
HCPL-90xx / HCPL-09xx Dual (Bidirectional) 8-pin DIP (300 Mil), 8-pin SOIC 100 Mbaud 2 ns 4 ns 2500 VRMS -40C to +100C
HCPL-90xx / HCPL-09xx Quad (Unidirectional) 16-pin SOIC (Wide Body), 16-pin SOIC (Narrow Body) 100 Mbaud 2 ns 4 ns 2500 VRMS -40C to +100C
HCPL-90xx / HCPL-09xx Quad (2 channels one direction, 2 opposite) 16-pin SOIC (Wide Body), 16-pin SOIC (Narrow Body) 100 Mbaud 2 ns 4 ns 2500 VRMS -40C to +100C
HCPL-90xx / HCPL-09xx Quad (1 channel one direction, 3 opposite) 16-pin SOIC (Wide Body), 16-pin SOIC (Narrow Body) 100 Mbaud 2 ns 4 ns 2500 VRMS -40C to +100C
Parameter Symbol Min. Typ. Max. Unit Test Conditions
Supply Voltage VDD1, VDD2 3.0 5.5 V
Ambient Operating Temperature TA -40 100 C
Max. Pulse Width Distortion PWD 2 3 ns
Max. Propagation Delay Skew tPSK 4 6 ns
Max. Propagation Delay 15 ns
Common Mode Rejection CMR 15 kV/s min.
Isolation Voltage 2500 VRMS
Logic High Output Voltage VOH 0.8 * VDD2 VDD2 0.5 V IOUT = 4 mA, VIN = VIH
Logic Low Output Voltage VOL 0.5 0.8 V IOUT = 4 mA, VIN = VIL
Max. Data Rate 100 110 MBd CL = 15 pF
Clock Frequency fmax 50 MHz
Output Rise Time tR 1 3 ns (10% to 90%)
Output Fall Time tF 1 3 ns (10% to 90%)
Channel-to-Channel Skew tCSK 2 3 ns (Dual and Quad Channels)

Applications

  • Digital fieldbus isolation
  • Multiplexed data transmission
  • Computer peripheral interface
  • High-speed digital systems
  • Isolated data interfaces
  • Logic level shifting

Package Outline Drawings

Refer to the data sheet for detailed package outline drawings for the following package types: - 8-Pin PDIP (300 Mil) - 8-Pin Small Outline (SO-8) - 16-Pin Small Outline, Wide Body - 16-Pin Small Outline, Narrow Body

Insulation and Safety Related Specifications

Parameter Symbol Min. Typ. Max. Unit Test Conditions
Capacitance (Input-Output) CI-O pF f = 1 MHz
Capacitance (Input-Output) - Single Channel CI-O 1.1 pF f = 1 MHz
Capacitance (Input-Output) - Dual Channel CI-O 2.0 pF f = 1 MHz
Capacitance (Input-Output) - Quad Channel CI-O 4.0 pF f = 1 MHz
Barrier Resistance || Capacitance >1014 3 || pF
Creepage Distance (External) - 8-Pin PDIP 7.04 mm
Creepage Distance (External) - 8-Pin SOIC 4.04 mm
Creepage Distance (External) - 16-Pin SOIC Narrow Body 4.03 mm
Creepage Distance (External) - 16-Pin SOIC Wide Body 8.08 mm
Leakage Current 0.2 A 240 VRMS, 60 Hz

IEC 61010-1 Insulation Characteristics

Parameter Symbol Value Unit Description
Installation Classification I III / I IV For Rated Mains Voltage 150 Vrms / 300 Vrms
Pollution Degree 2 (DIN VDE 0110/1.89)
Maximum Working Insulation Voltage VIORM 150 / 300 VRMS

Soldering Profile

Recommended reflow soldering conditions per JEDEC Standard J-STD-020 (latest revision).

Absolute Maximum Ratings

Parameter Symbol Min. Max. Unit
Storage Temperature TS -55 150 C
Ambient Operating Temperature TA -55 125 C
Supply Voltage VDD1, VDD2 -0.5 7 V
Input Voltage VIN -0.5 VDD1 + 0.5 V
Voltage Output Enable (HCPL-9000/-0900) VOE -0.5 VDD2 + 0.5 V
Output Voltage VOUT -0.5 VDD2 + 0.5 V
Output Current Drive IOUT 10 mA
Lead Solder Temperature (10s) 260 C
ESD (Human Body Model) 2 kV

Application Information

Power Consumption: The low power consumption is achieved by detecting input edge transitions and converting them to narrow current pulses. Power consumption is frequency-dependent and independent of the mark-to-space ratio. Approximate supply current per channel: I(Input) = 40(f/fmax)(1/4) mA, where f is the operating frequency and fmax = 50 MHz.

Signal Status on Start-up and Shut Down: Due to signal differentiation and latching, an ambiguous output state may occur during power-up, shutdown, or power loss. Designers should consider including an initialization signal in the start-up circuit.

Bypassing and PC Board Layout: Low ESR 47 nF ceramic capacitors are recommended for power supply decoupling, placed close to VDD pins. Ground planes for GND1 and GND2 are highly recommended for data rates above 10 Mb/s.


2411271956_Broadcom-HCPL-901J_C6955788.pdf

Contact Our Experts And Get A Free Consultation!

Our mission is to offer "High Quality" & "Good Service" & "Fast Delivery" to help our clients to gain more profits.