digital isolators Broadcom HCPL-0930-000E designed for logic level shifting and high speed digital communication
Product Overview
The Broadcom HCPL-90xx and HCPL-09xx series are high-speed CMOS digital isolators designed for robust performance and excellent transient immunity. Featuring a symmetric magnetic coupling barrier, these isolators offer industry-leading speed with a typical pulse width distortion of 2 ns, a typical propagation delay skew of 4 ns, and a 100 Mbaud data rate. They are available in single-channel, dual-channel (unidirectional and bidirectional), and quad-channel configurations, providing high channel density for isolating data conversion devices, parallel buses, and peripheral interfaces. These isolators are suitable for digital fieldbus applications, multiplexed data transmission, computer peripheral interfaces, high-speed digital systems, isolated data interfaces, and logic level shifting. They are specified for operation over a wide temperature range of 40C to +100C and are available in various packages including 8-pin PDIP, 8-pin Gull Wing, 8-pin SOIC, and 16-pin SOIC (narrow and wide body).
Product Attributes
- Brand: Broadcom
- Technology: CMOS Digital Isolators
- Certifications: UL1577, IEC 61010-1
- Package Types: 8-pin PDIP, 8-pin Gull Wing, 8-pin SOIC, 16-pin SOIC (Narrow Body), 16-pin SOIC (Wide Body)
- Operating Temperature Range: 40C to +100C
- ESD Sensitivity: Requires normal static precautions
- Not for: Military or aerospace applications or environments
Technical Specifications
| Model Series | Channel Configuration | Package | Data Rate | Pulse Width Distortion (Typ.) | Propagation Delay Skew (Typ.) | Isolation Voltage (RMS) | Common Mode Rejection (Min.) | Propagation Delay (Max.) | Pulse Width Distortion (Max.) | Propagation Delay Skew (Max.) | Channel-to-Channel Skew (Max.) | Common Mode Transient Immunity (Min.) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| HCPL-90xx / HCPL-09xx | Single | 8-pin DIP (300 Mil) / SO-8 | 100 MBd | 2 ns | 4 ns | 2500 Vrms | 15 kV/s | 15 ns (5V Op) / 18 ns (3.3V Op) | 3 ns | 6 ns | - | 15 kV/s |
| HCPL-90xx / HCPL-09xx | Dual Unidirectional | 8-pin DIP (300 Mil) / SO-8 | 100 MBd | 2 ns | 4 ns | 2500 Vrms | 15 kV/s | 15 ns (5V Op) / 18 ns (3.3V Op) | 3 ns | 6 ns | 3 ns | 15 kV/s |
| HCPL-90xx / HCPL-09xx | Dual Bidirectional (Full-Duplex) | 8-pin DIP (300 Mil) / SO-8 | 100 MBd | 2 ns | 4 ns | 2500 Vrms | 15 kV/s | 15 ns (5V Op) / 18 ns (3.3V Op) | 3 ns | 6 ns | 3 ns | 15 kV/s |
| HCPL-90xx / HCPL-09xx | Quad Unidirectional | 16-pin SOIC Wide Body / Narrow Body | 100 MBd | 2 ns | 4 ns | 2500 Vrms | 15 kV/s | 15 ns (5V Op) / 18 ns (3.3V Op) | 3 ns | 6 ns | 3 ns | 15 kV/s |
| HCPL-90xx / HCPL-09xx | Quad (2 Channels One Direction, 2 Opposite) | 16-pin SOIC Wide Body / Narrow Body | 100 MBd | 2 ns | 4 ns | 2500 Vrms | 15 kV/s | 15 ns (5V Op) / 18 ns (3.3V Op) | 3 ns | 6 ns | 3 ns | 15 kV/s |
| HCPL-90xx / HCPL-09xx | Quad (1 Channel One Direction, 3 Opposite) | 16-pin SOIC Wide Body / Narrow Body | 100 MBd | 2 ns | 4 ns | 2500 Vrms | 15 kV/s | 15 ns (5V Op) / 18 ns (3.3V Op) | 3 ns | 6 ns | 3 ns | 15 kV/s |
| Supply Voltage (Recommended Operating): 3.0V to 5.5V (VDD1, VDD2) | ||||||||||||
| Logic Compatibility: +3.3V and +5V TTL/CMOS compatible | ||||||||||||
| Output Enable (HCPL-9000/-0900): Active Low (Tri-state output) | ||||||||||||
| Package Power Dissipation (Max): 150 mW (all package types) | ||||||||||||
| Barrier Resistance: >1014 (Typ.) | ||||||||||||
| Barrier Capacitance: 3 pF (Single), 3 pF (Dual), 7 pF (Quad) (Typ.) | ||||||||||||
| Creepage Distance (External): 7.04 mm (8-Pin PDIP), 4.04 mm (8-Pin SOIC), 4.03 mm (16-Pin SOIC Narrow), 8.08 mm (16-Pin SOIC Wide) | ||||||||||||
| Leakage Current: 0.2 A (Typ.) at 240 Vrms, 60 Hz | ||||||||||||
| Soldering Profile: Per JEDEC Standard J-STD-020 (latest revision) | ||||||||||||
2411271956_Broadcom-HCPL-0930-000E_C7201476.pdf
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